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Basic Chemicals Business Sector
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Specialty Chemicals Business Sector
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Research & Development Division
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- A~D
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- AGELESS™ (Generic Name: Oxygen absorber)
- AGELESS EYE™ (Generic Name: Oxygen Indicators)
- AGELESS OMAC™ (Generic Name: Oxygen-absorbing films)
- AGELESS™ZM (Generic Name: Oxygen absorbers for solid formulation)
- ALTESTER T-Ester (Generic Name: New polyester)
- Acrylic resin (Product Name: Optimas)
- Allyl methacrylate (AMA)
- Ammonia
- Anaerobic cultivation sets (Product Name: AnaeroPack™)
- Aqueous ammonia
- BT materials (Generic Name: Laminated materials for printed circuit boards)
- Benzyl methacrylate (BZMA)
- BioPQQ™ (Generic Name: Pyrroloquinoline quinone (PQQ))
- Biobased Polyamide Resins (Product Name: LEXTER™)
- Catalyzer
- Chemical polishing agent (Product Name: Clean Etch series)
- Chemicals for electronics industry (Product Name: ELM clean)
- Cuminaldehyde (CUMAL)
- Cyanate Ester Monomer (Product Name: CYTESTER™)
- Cyclohexane-1,2,4,5-tetracarboxylic acid-1,2,4,5-dianhydride (Product Name: H-PMDA)
- Cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride (Product Name: H-TMAn/H-TMAn-S)
- Cyclohexyl methacrylate (CHMA)
- Diethylaminoethyl methacrylate (Product Name: Diethylaminoethyl methacrylate)
- Dimethyl ether
- Dimethylacetamide
- Dimethylamine
- Dimethylaminoethanol
- Dimethylaminoethyl methacrylate
- Dimethylformamide
- Dioxane glycol
- E~H
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- ELM clean (Generic Name: Chemicals for electronics industry)
- Epoxy resin curing agent (Product Name: Gaskamine 240)
- Epoxy resin curing agent (Product Name: Gaskamine 328)
- Fermeast™ SP (Generic Name: Spermidine containing yeast)
- Formaldehyde (Formalin)
- Formalol (M, NB, IB)
- Formamide
- Gas-barrier adhesive resin (Product Name: MAXIVE™)
- Glycidyl methacrylate
- H-PMDA (Generic Name: Cyclohexane-1,2,4,5-tetracarboxylic acid-1,2,4,5-dianhydride)
- H-TMAn/H-TMAn-S (Generic Name: Cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride)
- High Performance Polyamide Resin (Product Name: Reny)
- High-Purity Hydrogen Gas Production Equipment
- Hydrogen peroxide
- Esterglycol (Hydroxypivalyl hydroxypivalate)
- I~L
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- Isophthalonitrile
- Iupiace (Generic Name: Modified polyphenylene ether resin)
- Iupilon (Generic Name: Polycarbonate resin)
- Iupital (Generic Name: Polyacetal resin)
- Iupizeta EP (Generic Name: Optical resin polymer)
- Iupizeta™, Solvent-soluble special polycarbonate polymer
- LE SHEET (Generic Name: Subsidiary material for the drilling of printed circuit boards)
- LEXTER™ (Generic Name: Biobased Polyamide Resins)
- Laminated materials for printed circuit boards (Product Name: BT materials)
- Lauryl methacrylate
- i-Butyl methacrylate
- M~P
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- MAXIVE™ (Generic Name: Gas-barrier adhesive resin)
- Meta-xylene
- Meta-xylenediamine
- Methacrylate blend
- Methacrylic acid
- Methanol
- Methyl formate
- Methyl methacrylate
- Methylamine
- Modified polyphenylene ether resin (Product Name: Iupiace)
- Monomethylamine
- N-Methyl formamide
- Neopentylglycol
- Neopulim™ (Generic Name: Transparent polyimide varnish)
- New medicine container (Product Name: OXYCAPT™)
- New polyester (Product Name: ALTESTER T-Ester)
- Nylon-MXD6 (Product Name: MX-Nylon)
- Optical resin polymer (Product Name: Iupizeta EP)
- Optimas (Generic Name: Acrylic resin)
- Organic titanates
- Ortho-xylene
- Oxygen Indicators (Product Name: AGELESS EYE™)
- Oxygen absorber (Product Name: AGELESS™)
- Oxygen absorbers for solid formulation (Product Name: AGELESS™ZM)
- Oxygen absorbing desiccant (Product Name: PharmaKeep™)
- Oxygen and moisture free packaging for industrial products (Product Name: RP System)
- Oxygen-absorbing films (Product Name: AGELESS OMAC™)
- Para-xylene
- Peracetic acid
- Persulfates
- Plastic lens monomers
- Polyacetal resin (Product Name: Iupital)
- Polycarbonate resin (Product Name: Iupilon)
- Polycarbonate sheet/film
- Polyfunctional liquid epoxy resin (Product Name: TETRAD-C)
- Polyfunctional liquid epoxy resin (Product Name: TETRAD-X)
- Purified isophthalic acid(PIA)
- Pyrroloquinoline quinone (PQQ) (Product Name: BioPQQ™)
- n-Butyl methacrylate
- para-Ethylbenzaldehyde (EBAL)
- para-Isobutylbenzaldehyde (IBBAL)
- para-Phenylbenzaldehyde (4-BPAL)
- para-Tolualdehyde (PTAL)
- Q~T
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- RP System (Generic Name: Oxygen and moisture free packaging for industrial products)
- Reny (Generic Name: High Performance Polyamide Resin)
- Spermidine containing yeast (Product Name: Fermeast™ SP)
- Spiroglycol
- Stearyl methacrylate
- Subsidiary material for the drilling of printed circuit boards (Product Name: LE SHEET)
- Super-pure ammonium hydroxide
- Super-pure hydrogen peroxide
- TETRAD-C (Generic Name: Polyfunctional liquid epoxy resin)
- TETRAD-X (Generic Name: Polyfunctional liquid epoxy resin)
- Thermoplastic polyimide resin (Product Name: Therplim TO65)
- Transparent polyimide varnish (Product Name: Neopulim™)
- Trimellitic anhydride
- Trimethylamine
- Trimethylolethane
- s-Lauryl methacrylate
- U~Z
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