CYTESTER™ (Cyanate Ester Monomer)
CYTESTER™ is a thermosetting resin containing –OCN groups. By repeating cyclotrimerization of three –OCN groups, cyanate esters form three-dimensional network polymers linked by triazine rings.
The polymers of CYTESTER™ possess excellent thermal and electrical properties. In addition, they can be modified by formulation with other thermosetting resins such as epoxies, maleimides and benzoxazines.
Structure and Curing Mechanism of CYTESTER™
- Properties of Cyanate Ester Monomers
- Low Melt Viscosity
- Good Solubility in Common Solvents
- Compatible with Other Resins
- Properties of Cured Resins
- High Tg
- Low Thermal Expansion
- Low Dk, Df
- Good Electrical Insulation
Main Applications
- Electronic Materials: Printed Wiring Boards for high frequency devices, Thermal Conductive Materials, etc.
- Structural Materials: FRPs, Adhesives, etc.
Properties of Homopolymers of CYTESTER™
| Unit | CYTESTER™ TA (Standard Grade) |
TA-100 (R&D Grade) |
TA-1500 (R&D Grade) |
P-201 (R&D Grade) |
Anhydride Epoxy Resin System*1 (Reference) |
|
|---|---|---|---|---|---|---|
| Feature | Standard | TA Prepolymers | Liquid at Room Temputure |
- | ||
| Melt Viscosity （40℃） |
mPa·s | Solid | Viscous Liquid | Solid | 28 | - |
| Melt Viscosity （80℃） |
13 | 660 | 71300 | 9 | - | |
| Tg*2 | ℃ | 325 | 330 | 325 | 296 | 150 |
| CTEα1*3 | ppm/℃ | 54 | 50 | 50 | 53 | 72 |
| Flexural Strength*4 |
MPa | 136 | 110 | 122 | 127 | 126 |
| Flexural Modulus*4 |
GPa | 2.8 | 2.9 | 2.9 | 2.6 | 2.8 |
- *1 DGEBF(curing egent Me-HHPA)
- *2 DMA
- *3 ASTM D696
- *4 ASTM D790
- Curing Conditions
- 150℃/3h+180℃/5h+250℃/3h （TA, TA-100, TA-1500, P-201）
100℃/1h+150℃/3h（Epoxy Resin）
All data are typical data and not guaranteed.
Inquiries Concerning Products
Green Energy & Chemicals Business Sector
High-performance Products Division
HP Material Department
TEL：+81-3-3283-4800 / FAX：+81-3-3214-0938