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Non-haloganated Low CTE BT Resin Laminate for IC Plastic Packages

Non-haloganated BT Materials

These are halogen free materials for PWB use. The halogen free materials achieve a flammability rating of UL94V-0 without using halogens, antimony, or phosphorus compound. The substitution of an inorganic filler as the flame retardant, has the additional benefits of improving the small hole CO2 laser drilling properties, and lowering the CTE.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-HL832NX
type A Series

GHPL-830NX
type A Series

0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6, 0.7, 0.8

0.02 ~ 0.1

Features

CCL-HL832NX Type A / GHPL-830NX Type A is a halogen free BT material for IC plastic packages.
These are suitable for lead-free reflow process, because of good heat resistance, high stiffness, and low CTE.

Typical applications

These have been used for various applications as the de facto standard of halogen free materials for IC plastic packages.
CSP, BGA, Flip Chip Package, SiP, Module, etc.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-HL832NX(B)
Series

GHPL-830NX(B)
Series

0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6, 0.7, 0.8

0.02 ~ 0.1

Features

CCL-HL832NX(B) / GHPL-830NX(B) is a halogen free BT material for IC plastic packages.
They have lower CTE and lower shrinkage than them of CCL-HL832NX Type A / GHPL-830NX Type A.
CCL-HL832NX(B) / GHPL-830NX(B) is expected to be used for various applications as a new standard material, which is tailored to miniaturization of semiconductor package technology.

Typical applications

CSP, BGA, Flip Chip Package, SiP, Module, etc.

Non-haloganated Low CTE BT Materials

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-832NS
Series

GHPL-830NS
Series

0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8

0.015 ~ 0.1

CCL-832NS
type LC Series
GHPL-830NS
type LC Series
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4

0.015 ~ 0.1

Features

Low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
Show superior heat resistance after moisture absorption because of low moisture absorption.
Suitable for coreless process, because of low resin shrinkage of prepregs.
30um copper clad laminate and 15um prepreg are available.
Low CTE glass is applied to HL832NS type LC and it achieves lower CTE and high stiffness.

Typical applications

These have been used for various applications as the de facto standard of low CTE, halogen free materials for IC plastic packages.
CSP, BGA, Flip Chip Package, Coreless, SiP, Module, etc.

Adoption examples

Application Processor, Baseband, PMIC, DRAM, Flash Memory, PA, RF Module, ECU for Automotive, Various Sensor (MEMS, Optical, Fingerprint), etc.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-832NSR
type LC Series

GHPL-830NSR
typeLC Series

0.03,0.04,0.05,0.06,0.1,0.15,
0.2,0.25,0.3,0.4

0.02 ~ 0.045

CCL-HL832NSR
Series

GHPL-830NSR
Series

0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4

0.02 ~ 0.08

Features

Ultra low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
Suitable for coreless process, because of low resin shrinkage of prepregs.

Typical applications

Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc.

Adoption examples

Application Processor, Mobile DRAM, RF Module, etc.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-832NSF
type LC Series

GHPL-830NSF
type LC Series

0.03, 0.04, 0.05, 0.06, 0.08, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4

0.015 ~ 0.1

CCL-HL832NSF
Series

GHPL-830NSF
Series

0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4

0.015 ~ 0.1

Features

Supre ultra low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
High glass transition temperature
High stiffness
Suitable for coreless process, because of low resin shrinkage of prepregs.

Typical applications

These have been used for various applications, mainly Flip Chip Package, because of their super ultra low CTE, high Tg, high stiffness.
Suitable for the applications which requires high heat resistance such as automotive use.
Flip Chip Package, Coreless, CSP, BGA, SiP, Module, etc.

Adoption examples

Application Processor, Baseband, GPU, DRAM, Flash Memory, ECU for Automotive, Various Sensor (Fingerprint, CMOS), LED, etc.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-HL832NSA
type LC Series

GHPL-830NSA
type LC Series

0.04 ~ 0.4

0.025 ~ 0.08

Features

These are the latest materials for low CTE, low shrinkage, and high Tg.
Effective to reduce the warpage of substrate for IC package.

Typical applications

Suitable for Flip Chip package, because of low CTE, high Tg performance.
Flip Chip Package, CSP, BGA, etc.

Adoption examples

Application Processor, GPU, etc.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

-

GHPL-830SR
type LC Series

-

0.015 ~ 0.08

-

GHPL-830SR
Series

-

0.015 ~ 0.08

Features

These materials focus on coreless process.
Show stress relaxation performance during coreless process, and also have low CTE and low shrinkage.
Effective to reduce the warpage of coreless substrate for IC package.

Typical applications

Coreless, CSP, BGA, Flip Chip Package, etc.

Adoption examples

Application Processor, Mobile DRAM, etc.

Low Transmission Loss, Low CTE, Non-halogenated BT Laminates

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-HL972LF
type LD Series

GHPL-970LF
type LD Series

0.04 ~ 0.8

0.02 ~ 0.1

CCL-HL972LF
Series

GHPL-970LF
Series

0.04 ~ 0.8

0.02 ~ 0.1

Features

Low transmission loss materials for high frequency, high speed signal use.
Achieved low Dk and low Df, as well as keeping high heat resistance, low CTE, low shrinkage, and high peel strength with copper, equivalent to conventional BT laminates.
PCB makers can apply the same manufacturing process as conventinal BT laminates.
Suitable for multi-layers and coreless process, because of excellent formability and low shrinkage.
Low profile copper foils, which is effective to decrease transmission loss, can be applied, because of high peel strength with copper as well as low Dk and Df properties.

Typical applications

High frequency, High speed signal devices.
SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc.

Adoption/Evaluation examples

RF module for 5G smartphone, Base station (Antenna module for small cell, Power amplifier board), Millimeter-wave radar, Optical transmission module for data center and HPC, Measuring equipments, etc.

Typical properties of Materials
Item Measurement
Method
Unit HL832NX
(A)
HL832NX
(B)
HL832NS HL832NS
type LC

Dielectric Constant

  1GHz 4.9 4.4 4.4 4.0
  5GHz 4.8 4.3 4.3 3.9
  10GHz 4.7 4.2 4.3 3.9

Dissipation Factor

  1GHz 0.011 0.007 0.006 0.006
  5GHz 0.011 0.01 0.008 0.007
  10GHz 0.012 0.011 0.008 0.008

Insulation Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16

Surface Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16

Volume Resistivity

  C-96/20/65 Ω・cm 1015-16 1015-16 1016-17 1016-17

Flexural Strength

    MPa 450 540 490 750

Flexural Modulus

    GPa 28 30 27 30

Tensile Strength

    MPa 270 310 290 400

Young's Modulus

    GPa 28 30 27 30

Glass Transition Temp.

DMA   ºC 230 230 255 255
TMA   ºC 200 210 230 230

Cofficent of Thermal Expansion

X,Y α1 ppm/ºC 14 11 10 7
X,Y α2 ppm/ºC 5 4 3 3

Peel Strength

  12μm KN/m 0.85 1.0 1.0 1.0

Flame Resistance

  E-168/70 V-0 V-0 V-0 V-0

Density

    g/cm3 2.1 2 1.9 1.9

Heat capacity

    J/kg・K 1.00 0.95 1.00 0.95
Thermal Conductivity       0.8 0.7 0.6 0.6

Poissin's ratio

    0.19 0.19
0.18 0.18

Moisture absorption

  85 ºC/85RH% 168h % 0.44 0.3 0.31 0.30
Typical properties of Materials
Item Measurement
Method
Unit HL832NSR HL832NSR type LCA HL832NSF HL832NSF typeLCA

Dielectric Constant

  1GHz 4.5 4.1 4.4 4.0
  5GHz 4.4 4.0 4.4 4.0
  10GHz 4.4 4.0 4.3 3.9

Dissipation Factor

  1GHz 0.008 0.008 0.006 0.006
  5GHz 0.011 0.011 0.008 0.008
  10GHz 0.012 0.012 0.008 0.008

Insulation Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16

Surface Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16

Volume Resistivity

  C-96/20/65 Ω・cm 1016-17 1016-17 1016-17 1016-17

Flexural Strength

    MPa 550 670 510 600

Flexural Modulus

    GPa 30 33 32 34

Tensile Strength

    MPa 280 420 290 390

Young's Modulus

    GPa 30 33 32 34

Glass Transition Temp.

DMA   ºC 230 230 300 300
TMA   ºC 210 210 270 270

Cofficent of Thermal Expansion

X,Y α1 ppm/ºC 8 4.5 5 3
X,Y α2 ppm/ºC   2 3 2

Peel Strength

  12μm KN/m 1.0 1.0 0.8 0.8

Flame Resistance

  E-168/70 V-0 V-0 V-0 V-0

Density

    g/cm3 2.0 2.0 2.0 2.0

Heat capacity

    J/kg・K 0.95 0.95 0.9 0.9
Thermal Conductivity       0.7 0.7 0.7 0.7

Poissin's ratio

    0.18 0.18 0.19 0.18

Moisture absorption

  85 ºC/85RH% 168h % 0.32 0.32 0.35 0.35
Typical properties of Materials
Item Measurement
Method
Unit HL832
NSA typeLCA
HL972LF HL972LF typeLD GHPL-830SR GHPL-830SR typeLC

Dielectric Constant

  1GHz 4.0 3.9 3.5 3.9 3.7
  5GHz 4.0 3.8 3.5 3.8 3.6
  10GHz 3.9 3.7 3.4 3.7 3.5

Dissipation Factor

  1GHz 0.005 0.004 0.003 0.009 0.009
  5GHz 0.007 0.005 0.004 0.001 0.01
  10GHz 0.007 0.005 0.004 0.0011 0.011

Insulation Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16 1015-16

Surface Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16 1015-16

Volume Resistivity

  C-96/20/65 Ω・cm 1016-17 1016-17 1016-17 1016-17 1016-17

Flexural Strength

    MPa 420 380 370 420 490

Flexural Modulus

    GPa 31 26 25 21 22

Tensile Strength

    MPa 350 230 220 290 300

Young's Modulus

    GPa 31 26 25 21 22

Glass Transition Temp.

DMA   ºC >350 270 270 195 195
TMA   ºC 270 240 240 160 160

Cofficent of Thermal Expansion

X,Y α1 ppm/ºC 1 12 10 8.3 6.3
X,Y α2 ppm/ºC 0.5 4 4 3 2

Peel Strength

  12μm KN/m 0.6 0.7 0.7 1.0 1.0

Flame Resistance

  E-168/70 V-0 V-0 V-0 V-0 rating V-0 rating

Density

    g/cm3 2.0 1.9 1.9 1.8 1.8

Heat capacity

    J/kg・K 0.9 0.9 0.9 0.9 0.9
Thermal Conductivity       0.7 0.6 0.6 0.7 0.7

Poissin's ratio

    0.15 0.2 0.2 0.21 0.21

Moisture absorption

  85 ºC/85RH% 168h % 0.39 0.35 0.35 0.25 0.25

MGC also has halogen free materials, CCL-HL820 and CCL-HL820WDI.
*1: Please refer to URL on the right, regarding UL certification of flame resistance.[UL Certification]新しいウィンドウが開きます
*2: Typical properties of 45um prepreg.