Non-haloganated Low CTE BT Resin Laminate for IC Plastic Packages
Non-haloganated BT Materials
These are halogen free materials for PWB use. The halogen free materials achieve a flammability rating of UL94V-0 without using halogens, antimony, or phosphorus compound. The substitution of an inorganic filler as the flame retardant, has the additional benefits of improving the small hole CO2 laser drilling properties, and lowering the CTE.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NX type A Series |
GHPL-830NX type A Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6, 0.7, 0.8 | 0.02 ～ 0.1 |
Features
CCL-HL832NX Type A / GHPL-830NX Type A is a halogen free BT material for IC plastic packages.
These are suitable for lead-free reflow process, because of good heat resistance, high stiffness, and low CTE.
Typical applications
These have been used for various applications as the de facto standard of halogen free materials for IC plastic packages.
CSP, BGA, Flip Chip Package, SiP, Module, etc.
Non-haloganated Low CTE BT Materials
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NS Series |
GHPL-830NS Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8 | 0.015 ～ 0.1 |
| CCL-HL832NS type LC Series |
GHPL-830NS type LC Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 | 0.015 ～ 0.1 |
Features
Low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
Show superior heat resistance after moisture absorption because of low moisture absorption.
Suitable for coreless process, because of low resin shrinkage of prepregs.
30um copper clad laminate and 15um prepreg are available.
Low CTE glass is applied to HL832NS type LC and it achieves lower CTE and high stiffness.
Typical applications
These have been used for various applications as the de facto standard of low CTE, halogen free materials for IC plastic packages.
CSP, BGA, Flip Chip Package, Coreless, SiP, Module, etc.
Adoption examples
Application Processor, Baseband, PMIC, DRAM, Flash Memory, PA, RF Module, ECU for Automotive, Various Sensor (MEMS, Optical, Fingerprint), etc.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NSR type LC Series |
GHPL-830NSR typeLC Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 |
0.02 ～ 0.045 |
| CCL-HL832NSR Series |
GHPL-830NSR Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 | 0.02 ～ 0.08 |
Features
Ultra low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
Suitable for coreless process, because of low resin shrinkage of prepregs.
Typical applications
Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc.
Adoption examples
Application Processor, Mobile DRAM, RF Module, etc.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NSF type LC Series |
GHPL-830NSF type LC Series |
0.03, 0.04, 0.05, 0.06, 0.08, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 | 0.015 ～ 0.1 |
| CCL-HL832NSF Series |
GHPL-830NSF Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.4 | 0.015 ～ 0.1 |
Features
Supre ultra low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
High glass transition temperature
High stiffness
Suitable for coreless process, because of low resin shrinkage of prepregs.
Typical applications
These have been used for various applications, mainly Flip Chip Package, because of their super ultra low CTE, high Tg, high stiffness.
Suitable for the applications which requires high heat resistance such as automotive use.
Flip Chip Package, Coreless, CSP, BGA, SiP, Module, etc.
Adoption examples
Application Processor, Baseband, GPU, DRAM, Flash Memory, ECU for Automotive, Various Sensor (Fingerprint, CMOS）, LED, etc.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NSA type LC Series |
GHPL-830NSA type LC Series |
0.04 ～ 0.4 | 0.025 ～ 0.08 |
Features
These are the latest materials for low CTE, low shrinkage, and high Tg.
Effective to reduce the warpage of substrate for IC package.
Typical applications
Suitable for Flip Chip package, because of low CTE, high Tg performance.
Flip Chip Package, CSP, BGA, etc.
Adoption examples
Application Processor, GPU, etc.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| - | GHPL-830SR type LC Series |
- | 0.015 ～ 0.08 |
| - | GHPL-830SR Series |
- | 0.015 ～ 0.08 |
Features
These materials focus on coreless process.
Show stress relaxation performance during coreless process, and also have low CTE and low shrinkage.
Effective to reduce the warpage of coreless substrate for IC package.
Typical applications
Coreless, CSP, BGA, Flip Chip Package, etc.
Adoption examples
Application Processor, Mobile DRAM, etc.
Low Transmission Loss, Low CTE, Non-halogenated BT Laminates
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL972LF type LD Series |
GHPL-970LF type LD Series |
0.04 ～ 0.8 | 0.02 ～ 0.1 |
| CCL-HL972LFG type LD Series |
GHPL-970LFG type LD Series |
0.04 ～ 0.5 | 0.025 ～ 0.1 |
| CCL-HL972LFG Series |
GHPL-970LFG Series |
0.04 ～ 0.5 | 0.025 ～ 0.1 |
Features
Low transmission loss materials for high frequency, high speed signal use.
Achieved low Dk and low Df, as well as keeping high heat resistance, low CTE, low shrinkage, and high peel strength with copper, equivalent to conventional BT laminates.
PCB makers can apply the same manufacturing process as conventinal BT laminates.
Suitable for multi-layers and coreless process, because of excellent formability and low shrinkage.
Low profile copper foils, which is effective to decrease transmission loss, can be applied, because of high peel strength with copper as well as low Dk and Df properties.
Typical applications
High frequency, High speed signal devices.
SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc.
Adoption/Evaluation examples
RF module for 5G smartphone, Base station (Antenna module for small cell, Power amplifier board）, Millimeter-wave radar, Optical transmission module for data center and HPC, Measuring equipments, etc.
| Item | Measurement Method |
Unit | HL832NX (A) |
HL832NS | HL832NS type LC |
HL832NSR | |
|---|---|---|---|---|---|---|---|
| Dielectric Constant | 1GHz | － | 4.9 | 4.4 | 4.0 | 4.5 | |
| 5GHz | － | 4.8 | 4.3 | 3.9 | 4.4 | ||
| 10GHz | － | 4.7 | 4.3 | 3.9 | 4.4 | ||
| Dissipation Factor | 1GHz | － | 0.011 | 0.006 | 0.006 | 0.008 | |
| 5GHz | － | 0.011 | 0.008 | 0.007 | 0.011 | ||
| 10GHz | － | 0.012 | 0.008 | 0.008 | 0.012 | ||
| Insulation Resistance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Surface Resistance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Volume Resistivity | C-96/20/65 | Ω･cm | 1015-16 | 1016-17 | 1016-17 | 1016-17 | |
| Flexural Strength | MPa | 450 | 490 | 750 | 550 | ||
| Flexural Modulus | GPa | 28 | 27 | 30 | 30 | ||
| Tensile Strength | MPa | 270 | 290 | 400 | 280 | ||
| Young's Modulus | GPa | 28 | 27 | 30 | 30 | ||
| Glass Transition Temp. | DMA | ºC | 230 | 255 | 255 | 230 | |
| TMA | ºC | 200 | 230 | 230 | 210 | ||
| Cofficent of Thermal Expansion | X,Y | α1 | ppm/ºC | 14 | 10 | 7 | 8 |
| X,Y | α2 | ppm/ºC | 5 | 3 | 3 | 3 | |
| Peel Strength | 12μm | KN/m | 0.85 | 1.0 | 1.0 | 1.0 | |
| Flame Resistance | E-168/70 | － | V-0 | V-0 | V-0 | V-0 | |
| Density | g/cm3 | 2.1 | 1.9 | 1.9 | 2.0 | ||
| Specific heat | J/g・K | 1.00 | 1.00 | 0.95 | 0.95 | ||
| Thermal Conductivity | W/m*K | 0.8 | 0.6 | 0.6 | 0.7 | ||
| Poissin's ratio | － | 0.19 | 0.18 | 0.18 | 0.18 | ||
| Moisture absorption | 85 ºC/85RH% 168h | % | 0.44 | 0.31 | 0.30 | 0.32 | |
| Item | Measurement Method |
Unit | HL832NSR type LCA |
HL832NSF | HL832NSF typeLCA |
HL832 NSA typeLCA |
|
|---|---|---|---|---|---|---|---|
| Dielectric Constant | 1GHz | － | 4.1 | 4.4 | 4.0 | 4.0 | |
| 5GHz | － | 4.0 | 4.4 | 4.0 | 4.0 | ||
| 10GHz | － | 4.0 | 4.3 | 3.9 | 3.9 | ||
| Dissipation Factor | 1GHz | － | 0.008 | 0.006 | 0.006 | 0.005 | |
| 5GHz | － | 0.011 | 0.008 | 0.008 | 0.007 | ||
| 10GHz | － | 0.012 | 0.008 | 0.008 | 0.007 | ||
| Insulation Resistance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Surface Resistance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Volume Resistivity | C-96/20/65 | Ω･cm | 1016-17 | 1016-17 | 1016-17 | 1016-17 | |
| Flexural Strength | MPa | 670 | 510 | 600 | 420 | ||
| Flexural Modulus | GPa | 33 | 32 | 34 | 31 | ||
| Tensile Strength | MPa | 420 | 290 | 390 | 350 | ||
| Young's Modulus | GPa | 33 | 32 | 34 | 31 | ||
| Glass Transition Temp. | DMA | ºC | 230 | 300 | 300 | >350 | |
| TMA | ºC | 210 | 270 | 270 | 270 | ||
| Cofficent of Thermal Expansion | X,Y | α1 | ppm/ºC | 4.5 | 5 | 3 | 1 |
| X,Y | α2 | ppm/ºC | 2 | 3 | 2 | 0.5 | |
| Peel Strength | 12μm | KN/m | 1.0 | 0.8 | 0.8 | 0.6 | |
| Flame Resistance | E-168/70 | － | V-0 | V-0 | V-0 | V-0 | |
| Density | g/cm3 | 2.0 | 2.0 | 2.0 | 2.0 | ||
| Specific heat | J/g･K | 0.95 | 0.9 | 0.9 | 0.9 | ||
| Thermal Conductivity | W/m*K | 0.7 | 0.7 | 0.7 | 0.7 | ||
| Poissin's ratio | － | 0.18 | 0.19 | 0.18 | 0.15 | ||
| Moisture absorption | 85 ºC/85RH% 168h | % | 0.32 | 0.35 | 0.35 | 0.39 | |
| Item | Measurement Method |
Unit | HL972LF typeLD | HL972LFG | HL972LFG typeLD | GHPL-830SR | GHPL-830SR typeLC | |
|---|---|---|---|---|---|---|---|---|
| Dielectric Constant | 1GHz | － | 3.5 | 4.0 | 3.5 | 3.9 | 3.7 | |
| 5GHz | － | 3.5 | 3.9 | 3.5 | 3.8 | 3.6 | ||
| 10GHz | － | 3.4 | 3.8 | 3.4 | 3.7 | 3.5 | ||
| Dissipation Factor | 1GHz | － | 0.003 | 0.003 | 0.002 | 0.009 | 0.009 | |
| 5GHz | － | 0.004 | 0.004 | 0.002 | 0.01 | 0.01 | ||
| 10GHz | － | 0.004 | 0.004 | 0.002 | 0.011 | 0.011 | ||
| Insulation Resistance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Surface Resistance | C-96/20/65 | Ω | 1015-16 | 1015-16 | 1015-16 | 1015-16 | 1015-16 | |
| Volume Resistivity | C-96/20/65 | Ω･cm | 1016-17 | 1016-17 | 1016-17 | 1016-17 | 1016-17 | |
| Flexural Strength | MPa | 370 | 450 | 440 | 420 | 490 | ||
| Flexural Modulus | GPa | 25 | 23 | 21 | 21 | 22 | ||
| Tensile Strength | MPa | 220 | 210 | 210 | 290 | 300 | ||
| Young's Modulus | GPa | 25 | 23 | 21 | 21 | 22 | ||
| Glass Transition Temp. | DMA | ºC | 270 | 215 | 215 | 195 | 195 | |
| TMA | ºC | 240 | 200 | 200 | 160 | 160 | ||
| Cofficent of Thermal Expansion | X,Y | α1 | ppm/ºC | 10 | 11 | 10 | 8.3 | 6.3 |
| X,Y | α2 | ppm/ºC | 4 | 4 | 4 | 3 | 2 | |
| Peel Strength | 12μm | KN/m | 0.7 | 0.7 | 0.7 | 1.0 | 1.0 | |
| Flame Resistance | E-168/70 | － | V-0 | V-0 rating |
V-0 rating |
V-0 rating |
V-0 rating |
|
| Density | g/cm3 | 1.9 | 1.8 | 1.8 | 1.8 | 1.8 | ||
| Specific heat | J/g･K | 0.9 | 0.95 | 0.95 | 0.9 | 0.9 | ||
| Thermal Conductivity | W/m*K | 0.6 | 0.6 | 0.6 | 0.7 | 0.7 | ||
| Poissin's ratio | － | 0.2 | - | - | 0.21 | 0.21 | ||
| Moisture absorption | 85 ºC/85RH% 168h | % | 0.35 | 0.27 | 0.27 | 0.25 | 0.25 | |
※MGC also has halogen free materials, CCL-HL820 and CCL-HL820WDI.
*1: Please refer to URL on the right, regarding UL certification of flame resistance.[UL Certification]
*2: Typical properties of 45um prepreg.
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