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Non-haloganated Low CTE BT Resin Laminate for IC Plastic Packages

Non-haloganated BT Materials

These are halogen free materials for PWB use. The halogen free materials achieve a flammability rating of UL94V-0 without using halogens, antimony, or phosphorus compound. The substitution of an inorganic filler as the flame retardant, has the additional benefits of improving the small hole CO2 laser drilling properties, and lowering the CTE.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-HL832NX
type A Series
GHPL-830NX
type A Series
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6, 0.7, 0.8 0.02 ~ 0.1

Features

CCL-HL832NX Type A / GHPL-830NX Type A is a halogen free BT material for IC plastic packages.
These are suitable for lead-free reflow process, because of good heat resistance, high stiffness, and low CTE.

Typical applications

These have been used for various applications as the de facto standard of halogen free materials for IC plastic packages.
CSP, BGA, Flip Chip Package, SiP, Module, etc.

Non-haloganated Low CTE BT Materials

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-832NS
Series
GHPL-830NS
Series
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8 0.015 ~ 0.1
CCL-832NS
type LC Series
GHPL-830NS
type LC Series
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 0.015 ~ 0.1

Features

Low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
Show superior heat resistance after moisture absorption because of low moisture absorption.
Suitable for coreless process, because of low resin shrinkage of prepregs.
30um copper clad laminate and 15um prepreg are available.
Low CTE glass is applied to HL832NS type LC and it achieves lower CTE and high stiffness.

Typical applications

These have been used for various applications as the de facto standard of low CTE, halogen free materials for IC plastic packages.
CSP, BGA, Flip Chip Package, Coreless, SiP, Module, etc.

Adoption examples

Application Processor, Baseband, PMIC, DRAM, Flash Memory, PA, RF Module, ECU for Automotive, Various Sensor (MEMS, Optical, Fingerprint), etc.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-832NSR
type LC Series
GHPL-830NSR
typeLC Series
0.03,0.04,0.05,0.06,0.1,0.15,
0.2,0.25,0.3,0.4
0.02 ~ 0.045
CCL-HL832NSR
Series
GHPL-830NSR
Series
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 0.02 ~ 0.08

Features

Ultra low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
Suitable for coreless process, because of low resin shrinkage of prepregs.

Typical applications

Coreless, SiP, Module, CSP, BGA, Flip Chip Package, etc.

Adoption examples

Application Processor, Mobile DRAM, RF Module, etc.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-832NSF
type LC Series
GHPL-830NSF
type LC Series
0.03, 0.04, 0.05, 0.06, 0.08, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4 0.015 ~ 0.1
CCL-HL832NSF
Series
GHPL-830NSF
Series
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.4 0.015 ~ 0.1

Features

Supre ultra low CTE and low shrinkage which are effective to reduce the warpage of substrate for IC package.
High glass transition temperature
High stiffness
Suitable for coreless process, because of low resin shrinkage of prepregs.

Typical applications

These have been used for various applications, mainly Flip Chip Package, because of their super ultra low CTE, high Tg, high stiffness.
Suitable for the applications which requires high heat resistance such as automotive use.
Flip Chip Package, Coreless, CSP, BGA, SiP, Module, etc.

Adoption examples

Application Processor, Baseband, GPU, DRAM, Flash Memory, ECU for Automotive, Various Sensor (Fingerprint, CMOS), LED, etc.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-HL832NSA
type LC Series
GHPL-830NSA
type LC Series
0.04 ~ 0.4 0.025 ~ 0.08

Features

These are the latest materials for low CTE, low shrinkage, and high Tg.
Effective to reduce the warpage of substrate for IC package.

Typical applications

Suitable for Flip Chip package, because of low CTE, high Tg performance.
Flip Chip Package, CSP, BGA, etc.

Adoption examples

Application Processor, GPU, etc.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
- GHPL-830SR
type LC Series
- 0.015 ~ 0.08
- GHPL-830SR
Series
- 0.015 ~ 0.08

Features

These materials focus on coreless process.
Show stress relaxation performance during coreless process, and also have low CTE and low shrinkage.
Effective to reduce the warpage of coreless substrate for IC package.

Typical applications

Coreless, CSP, BGA, Flip Chip Package, etc.

Adoption examples

Application Processor, Mobile DRAM, etc.

Low Transmission Loss, Low CTE, Non-halogenated BT Laminates

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-HL972LF
type LD Series
GHPL-970LF
type LD Series
0.04 ~ 0.8 0.02 ~ 0.1
CCL-HL972LFG
type LD Series
GHPL-970LFG
type LD Series
0.04 ~ 0.5 0.025 ~ 0.1
CCL-HL972LFG
Series
GHPL-970LFG
Series
0.04 ~ 0.5 0.025 ~ 0.1

Features

Low transmission loss materials for high frequency, high speed signal use.
Achieved low Dk and low Df, as well as keeping high heat resistance, low CTE, low shrinkage, and high peel strength with copper, equivalent to conventional BT laminates.
PCB makers can apply the same manufacturing process as conventinal BT laminates.
Suitable for multi-layers and coreless process, because of excellent formability and low shrinkage.
Low profile copper foils, which is effective to decrease transmission loss, can be applied, because of high peel strength with copper as well as low Dk and Df properties.

Typical applications

High frequency, High speed signal devices.
SiP, Module, CSP, BGA, Flip Chip Package, Coreless, etc.

Adoption/Evaluation examples

RF module for 5G smartphone, Base station (Antenna module for small cell, Power amplifier board), Millimeter-wave radar, Optical transmission module for data center and HPC, Measuring equipments, etc.

Typical properties of Materials
Item Measurement
Method
Unit HL832NX
(A)
HL832NS HL832NS
type LC
HL832NSR
Dielectric Constant   1GHz 4.9 4.4 4.0 4.5
  5GHz 4.8 4.3 3.9 4.4
  10GHz 4.7 4.3 3.9 4.4
Dissipation Factor   1GHz 0.011 0.006 0.006 0.008
  5GHz 0.011 0.008 0.007 0.011
  10GHz 0.012 0.008 0.008 0.012
Insulation Resistance   C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16
Surface Resistance   C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16
Volume Resistivity   C-96/20/65 Ω・cm 1015-16 1016-17 1016-17 1016-17
Flexural Strength     MPa 450 490 750 550
Flexural Modulus     GPa 28 27 30 30
Tensile Strength     MPa 270 290 400 280
Young's Modulus     GPa 28 27 30 30
Glass Transition Temp. DMA   ºC 230 255 255 230
TMA   ºC 200 230 230 210
Cofficent of Thermal Expansion X,Y α1 ppm/ºC 14 10 7 8
X,Y α2 ppm/ºC 5 3 3 3
Peel Strength   12μm KN/m 0.85 1.0 1.0 1.0
Flame Resistance   E-168/70 V-0 V-0 V-0 V-0
Density     g/cm3 2.1 1.9 1.9 2.0
Specific heat     J/kg・K 1.00 1.00 0.95 0.95
Thermal Conductivity     W/m*K 0.8 0.6 0.6 0.7
Poissin's ratio     0.19 0.18 0.18 0.18
Moisture absorption   85 ºC/85RH% 168h % 0.44 0.31 0.30 0.32
Typical properties of Materials
Item Measurement
Method
Unit HL832NSR type LCA HL832NSF HL832NSF typeLCA HL832
NSA typeLCA
Dielectric Constant   1GHz 4.1 4.4 4.0 4.0
  5GHz 4.0 4.4 4.0 4.0
  10GHz 4.0 4.3 3.9 3.9
Dissipation Factor   1GHz 0.008 0.006 0.006 0.005
  5GHz 0.011 0.008 0.008 0.007
  10GHz 0.012 0.008 0.008 0.007
Insulation Resistance   C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16
Surface Resistance   C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16
Volume Resistivity   C-96/20/65 Ω・cm 1016-17 1016-17 1016-17 1016-17
Flexural Strength     MPa 670 510 600 420
Flexural Modulus     GPa 33 32 34 31
Tensile Strength     MPa 420 290 390 350
Young's Modulus     GPa 33 32 34 31
Glass Transition Temp. DMA   ºC 230 300 300 >350
TMA   ºC 210 270 270 270
Cofficent of Thermal Expansion X,Y α1 ppm/ºC 4.5 5 3 1
X,Y α2 ppm/ºC 2 3 2 0.5
Peel Strength   12μm KN/m 1.0 0.8 0.8 0.6
Flame Resistance   E-168/70 V-0 V-0 V-0 V-0
Density     g/cm3 2.0 2.0 2.0 2.0
Specific heat     J/kg・K 0.95 0.9 0.9 0.9
Thermal Conductivity     W/m*K 0.7 0.7 0.7 0.7
Poissin's ratio     0.18 0.19 0.18 0.15
Moisture absorption   85 ºC/85RH% 168h % 0.32 0.35 0.35 0.39
Typical properties of Materials
Item Measurement
Method
Unit HL972LF typeLD HL972LFG HL972LFG typeLD GHPL-830SR GHPL-830SR typeLC
Dielectric Constant   1GHz 3.5 4.0 3.5 3.9 3.7
  5GHz 3.5 3.9 3.5 3.8 3.6
  10GHz 3.4 3.8 3.4 3.7 3.5
Dissipation Factor   1GHz 0.003 0.003 0.002 0.009 0.009
  5GHz 0.004 0.004 0.002 0.01 0.01
  10GHz 0.004 0.004 0.002 0.011 0.011
Insulation Resistance   C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16 1015-16
Surface Resistance   C-96/20/65 Ω 1015-16 1015-16 1015-16 1015-16 1015-16
Volume Resistivity   C-96/20/65 Ω・cm 1016-17 1016-17 1016-17 1016-17 1016-17
Flexural Strength     MPa 370 450 440 420 490
Flexural Modulus     GPa 25 23 21 21 22
Tensile Strength     MPa 220 210 210 290 300
Young's Modulus     GPa 25 23 21 21 22
Glass Transition Temp. DMA   ºC 270 215 215 195 195
TMA   ºC 240 200 200 160 160
Cofficent of Thermal Expansion X,Y α1 ppm/ºC 10 11 10 8.3 6.3
X,Y α2 ppm/ºC 4 4 4 3 2
Peel Strength   12μm KN/m 0.7 0.7 0.7 1.0 1.0
Flame Resistance   E-168/70 V-0 V-0
rating
V-0
rating
V-0
rating
V-0
rating
Density     g/cm3 1.9 1.8 1.8 1.8 1.8
Specific heat     J/kg・K 0.9 0.95 0.95 0.9 0.9
Thermal Conductivity     W/m*K 0.6 0.6 0.6 0.7 0.7
Poissin's ratio     0.2 - - 0.21 0.21
Moisture absorption   85 ºC/85RH% 168h % 0.35 0.27 0.27 0.25 0.25

MGC also has halogen free materials, CCL-HL820 and CCL-HL820WDI.
*1: Please refer to URL on the right, regarding UL certification of flame resistance.[UL Certification]新しいウィンドウが開きます
*2: Typical properties of 45um prepreg.

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