High Performance FR-4 for Multi-layered PWB
High Performance FR-4 for Multi-layered PWB
Copper Clad Laminates | Prepregs | CCL Thickness |
Prepreg Thickness |
---|---|---|---|
CCL-EL190T |
GEPL-190T |
0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50, 1.00, 1.20, 1.60mm |
0.03, 0.04, 0.05, 0.06, 0.08, 0.10, 0.15, 0.20mm |
Features
CCL-EL190T / GEPL-190T has a higher Tg, lower CTE properties compared to CCL-EL 190 / GEPL-190. It is available for lead free reflow process, and especially excels in through hole connection reliability for high count multilayer motherboards. And, microvias can be easily made in the prepreg layers by CO2 laser drilling.
Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
---|---|---|---|
CCL-EL230T |
GEPL-230T |
0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50mm |
0.04, 0.06, 0.10, 0.15mm |
Features
CCL-EL230T / GEPL-230T excels in through hole connection reliability because of its high Tg and low CTE properties. And also, it is very suitable for high frequency circuits because of its low dielectric properties. It excels in filling to BVH and IVH because of good resin flow properties. In addition, microvias can be easily made in the prepreg layers by CO2 laser drilling, and it is available for lead free reflow process.
Typical applications
High count multilayer motherboards for internet routers, servers, base stations, switching systems and IC tester devices.
Item | Condition | Unit | EL190T | EL230T | |
---|---|---|---|---|---|
Dielectric Constant |
1MHz |
A | - | 4.7 | 4.0 |
1GHz |
A | - | 4.3 | 3.8 | |
10GHz |
A | - | 4.1 | 3.6 | |
Dissipation Factor |
1MHz |
A | - | 0.010 | 0.004 |
1GHz |
A | - | 0.011 | 0.005 | |
10GHz |
A | - | 0.012 | 0.007 | |
Insulation Resistance |
C-96/20/65 | Ω | 5x1013-15 | 5x1013-15 | |
Surface Resistance |
C-96/20/65 | Ω | 5x1014-16 | 5x1014-16 | |
Volume Resistivity |
C-96/20/65 | Ω・cm | 5x1012-14 | 5x1012-14 | |
Flexural Strength |
Warp |
A | MPa | 580 | 470 |
Fill |
A | MPa | 530 | 460 | |
Flexural Modulus |
Warp |
A | GPa | 27 | 22 |
Fill |
A | GPa | 27 | 22 | |
Tensile Strength |
Warp |
A | MPa | 330 | 300 |
Fill |
A | MPa | 330 | 250 | |
Young's Modulus |
Warp |
A | GPa | 27 | 22 |
Fill |
A | GPa | 26 | 22 | |
Poisson's |
Warp |
A | - | 0.17 | 0.16 |
Fill |
A | - | 0.16 | 0.15 | |
Glass Transition Temp. |
DMA |
A | ℃ | 240 | 210 |
TMA |
A | ℃ | 220 | 175 | |
DSC |
A | ℃ | 215 | 175 | |
Cofficent of Thermal Expansion |
Warp, Fill |
A | ppm/℃ | 14 | 15 |
Z |
A | ppm/℃ | 40/180 | 45/240 | |
Thermal Conductivity |
Laser Pulse Heating Method |
A | W/m・K | 0.45 | 0.44 |
Specific Heat |
DSC |
A | J/g・K | 0.95 | 0.95 |
Decomposition Temp. |
TG-DTA |
A | ℃ | 345 | 335 |
Time to |
T-260 |
E-2/105 | minutes | >60 | >60 |
T-288 |
E-2/105 | minutes | 20 | 12 | |
T-300 |
E-2/105 | minutes | 7 | 3 | |
Peel Strength |
12μ |
A | KN/m | 0.9 | 0.9 |
18μ |
A | KN/m | 1.2 | 1.2 | |
18μ-VLP |
A | KN/m | 1.1 | 1.1 | |
Specific Gravity of Resin |
A | - | 1.44 | 1.42 | |
Flame Resistance |
UL94 |
E-168/70 | - | V-0 | V-0 |
Inquiries Concerning Products
Specialty Chemicals Business Sector
Electronics Materials Division
TEL:+81-3-3283-4740 / FAX:+81-3-3215-2558