BT Materials for Chip-LED
BT Materials for Chip-LED
These are the de facto standard materials for Chip-LED use. They excel in high reflectivity of visible light. And, they are very suitable for wire-bonding because of its stable mechanical properties at elevated temperatures and high heat resistance for longer term. In addition, they are halogen free materials.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL820WDI | - | 0.04, 0.05, 0.06, 0.1-1.0 (0.1step), 0.46 |
- |
Features
White material with high reflectance of visible light, much suitable for chip LED substrate.Less discoloration after heat treatment and light irradiation.
Typical applications
Chip-LED
| Item | Condition | Unit | HL820WDI | |
|---|---|---|---|---|
|
Dielectric Constant |
1MHz | A | - | - |
| 1GHz | A | - | 5.7 | |
|
Dissipation Factor |
1MHz | A | - | - |
| 1GHz | A | - | 0.020 | |
|
Insulation Resistance |
C-96/20/65 | Ω | 5x1013-15 | |
|
Surface Resistance |
C-96/20/65 | Ω | 5x1013-15 | |
|
Volume Resistivity |
C-96/20/65 | Ω・cm | 5x1014-16 | |
|
Flexural Strength |
Warp | A | MPa | 480 |
| Fill | A | MPa | 470 | |
|
Flexural Modulus |
Warp | A | GPa | 23 |
| Fill | A | GPa | 22 | |
|
Tensile Strength |
Warp | A | MPa | 290 |
| Fill | A | MPa | 280 | |
|
Young's Modulus |
Warp | A | GPa | 25 |
| Fill | A | GPa | 24 | |
|
Glass Transition Temp. |
DMA | A | ℃ | 210 |
| TMA | A | ℃ | 180 | |
|
Cofficent of Thermal Expansion |
Warp, Fill | A | ppm/℃ | 15 |
| Z(α1, α2) | A | ppm/℃ | 45/180 | |
|
Peel Strength |
12µ | A | KN/m | 1.0 |
| 18µ | A | KN/m | 1.1 | |
|
Flame Resistance |
UL94 | E-168/70 | - | HB |
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