Publications and Presentations
2007
| Title | Journals, Lectures, or Society Meetings |
|---|---|
| Dynamic viscoelastic and damping properties of polymer composite for Oberst beams Development and Applications of innovative damping materials “Neofade” |
Journal of the Society of Rubber Industry, Japan, January |
| Wet etching of ZnO thin film | 37th study meeting of 166th Committee on Photonic and Electronic Oxide Materials (Japan Society for the Promotion of Science) |
| Features and applications of PAI composite, AI polymer | Engineering plastics news, January |
| Foundations and applications of chemical polishing, Applications for manufacturing of electronic parts | 15th Technology seminar (Japan Photofabrication Association) |
| Bifunctional Low Molecular Weight Polyphenylene Ether Resins for PWB Base Materials | IPC Printed Circuits Expo 2007 |
| Reaction of H-TMAn with epoxy resin and properties of curing and products | Seminar for Technical Information Institute |
| Case study of the inter-granular cracking of die casting parts made by Zinc alloy and the evaluation method of cracking sensitivity | Symposium for Materials and Environment (Japan Society of Corrosion Engineering, Chugoku-Shikoku Branch) |
| Noise and vibration measures by high performance damping material “Neofade” | Convertech, March (Converting Technical Institute) |
| Adhesive agent with gas barrier character | Gas Separation, Permeation and Barrier Membranes (CMC Publishing) |
| Features and applications of oxygen absorbing film Ageless Omac | Gas Separation, Permeation and Barrier Membranes (CMC Publishing) |
| Plastic lens containing sulfur | The Frontiers of Sulfur Chemicals (CMC Publishing) |
| Reaction of Hydrogen Peroxide with Photo Activating Titanium dioxide Catalyst | The 5th International Federation of Esthetic Dentistry World Congress |
| Case study of the inter-granular cracking of die casting parts made by Zinc alloy and the evaluation method of cracking sensitivity | JSCE Materials and Environments 2007 |
| Reaction of H-TMAn with epoxy resin and properties of curing and products | 55th Annual Meeting |
| Features and Application of MX Nylon New Grade “K7007C” | CONVERTECH(6) |
| “The characteristic of Low Dk Printed Wiring Board material, and optimization of a material design” , “The feature of heat-resistant BT Resin material, and deployment to a Copper Clad Laminate” | “The collection of newest Electronics Packaging Encyclopedias ”(Technical Information Institute) |
| Technology of the low dielectric constant resin, OPE | Electronic materials/Plastic |
| Fluorination of β-Dicarbonyl Compounds by DFMBA | |
| Development status of DMFC in Mitsubishi Gas Chemical | The Journal of Fuel Cell Technology Vol.8 No.1 Summer 2008 |
| Heat resistant transparent film “NEOPULIM” | CONVERTECH,35(10),69(2007) |
| Effect of PC-Oligomer on Structure and Properties of PC/ABS Injection Moldings | SEIKEI KAKOU(Journal of the Japan Society of Polymer Processing) |
| Development of DMFC stacks and Power Generation Systems at Mitsubishi Gas Chemical Co., Inc. | The Journal of Fuel Cell Technology Vol.7 No.1 Summer 2007 (FCDIC) |
| Wet-Oxidation of Silicon Surface with the Gas-Dissolved Water and UV Irradiation | |
| Development of Stepchemical Process | The Japanese Society of Applied Physics, the 68th Autumn Meeting, 2007 |
| Influence of Copper Electrocrystallization on the Etching | The Japanese Society of Applied Physics, the 68th Autumn Meeting, 2007 |
| Dynamic kinetic resolution of racemic α-aminonitriles to form chiral amino acids |
Symposium of the 1 th Anniversaly of the Foundation of Yokohama Jisso Consortium |
| Production of In Vitro Fertilized Bovine Embryos Using Gas Concentration adjuster | The 3rd Meeting of D-Amino Acid Research Society |
| The Development of the Thermosetting Resin Having the High Refractive Index | The 100th annual meeting of the Japanese Society of Animal Reproduction |
| A damping material “Neofade”, which can be adjusted to the target temperature and vibration frequency | 'Polymer Colloquium' Sponsored by the Chemical Society of Japan touhoku branch office |
| Features and Application of MX Nylon New Grade “K7007C” | 16th Polymer Material Forum Press Release |
| Gas Barrier Coating System “MAXIVE” | The 45th All-Japan Packaging Technical Meeting |
| An acid anhydrides as hardener of epoxy resin, especially, reactions and advantages of H-TMAn | A Lecture in TECHNICAL INFORMATION INSTITUTE CO.,LTD |
| Growth of High Quality (Zn,Mg)O Thick Films on ZnO Substrates by Liquid Phase Epitaxy. | 2007 MRS Fall Meeting |
| OXYGEN AND MOISTURE FREE PACKAGING SOLUTION TO MAINTAIN DEVICES RELIABILITY FOR SOLDERING. | The Second International Symposium on Smart Processing Technology |
| Heat- and light-discoloring transparent epoxy resin cured by H-TMAn | 16th Polymer Material Forum |