Publications and Presentations
2008
| Title | Journals, Lectures, or Society Meetings |
|---|---|
| Effects of light irradiation on bleaching by a 3.5% hydrogen peroxide solution containing titanium dioxide | Laser Physics Letters |
| New Etchants for High Speed Anisotropic Etching of Silicon | Journal of The Surface Finishing Society of Japan Vol.59 No.2 |
| Evaluation of Adamantane derivatives for chemically amplified resist-a comparison between ArF,EUV and EB exposures- | SPIE Advanced Lithography 2008 |
| Thinly and Lightly Eye-Glass Lens | Chemistry & Chmical Industry ・ The Chemical Society of Japan |
| Features and Application of MX Nylon New Grade “K7007C” | |
| Fabrication of thin film silicon solar cells using substrates with resin texture | The 55th Spring Meeting of the Japan Society of Applied Physics and Related Societies |
| DNA introduction into living cell by water droplet impact with electrospray | Angewandte chemie International Edition 2008-47/8 |
| Film Insert Molding based on Polyoxymethylene and Poly(lactic acid): Effects of Molding Conditions and Crystallinity on the Interfacial Adhesion Properties | 19th Annual Meeting of the Japan Society of Polymer Processing (JSPP) |
| Oil-adsorptive and bioremediation agent | The 14th Symposium on Soil and Groundwater Contamination and Remediation |
| On-site Production of Peroxymonosulfuric Acid for Hexenuronic Acid Removal from Kraft Pulp | 2008 International Pulp Breaching Conference |
| Development and Applications of innovative damping materials “neofade” | KOBUNSHI (High Polymers, Japan) Vol.57 No.8 (2008) |
| Mitsubishi Gas Chamical's Methanol Process | “Kagakukougaku”(Chemical Engineering of Japan, 72(8) P25, (2008) |
| characteristics of neutral Fenton method for purification VOC of contaminated groundwater | Symposium on Soil and Groundwater Contamination and Remediation |
| Transparent PI film “NEOPULIM L” | Japanese Society of Printing Science and Technology P&L society |
| Basic Study on Scratch Behavior Induced by Dynamic Interaction Between Fiber Assemblies and Metallic Surface | 19th Annual Meeting of the Japan Society of Polymer Processing (JSPP) |
| Film Insert Molding based on Polyoxymethylene and Poly(lactic acid): Effects of Molding Conditions and Crystallinity on the Interfacial Adhesion Properties | 19th Annual Meeting of the Japan Society of Polymer Processing (JSPP) |
| New product release (HL832NS, FL700, LE900) | JPCA Show 2008 |
| New transparent PI film | Short Courses on Flexible Electronics |
| Preservation Method for Electronic Devices by Oxygen and Moisture Free Packaging, and Effectiveness of Prevent Delamination and Keeping Reliability of a Connection | 18th Micro-Electronics Symposium |
| VOC purification characteristic examination that uses neutral Fenton method | The Japanese Geotechnical Society |
| Mechanical Property and Crystal Structure of Polyoxymethylene and Poly(lactic acid)Polymer Blend | Seventh Joint Canada-japan Workshop on Composites |
| Characteristics of neutral Fenton method for purification VOC of contaminated groundwater and applications oｆ in-situ remediation | Japan Society of Civil Engineers |
| YUTLAS ACE | Soil and Groundwater Remediation Technology Expo 2008, Nikkan Kogyo Shimbun |
| Methanol (Part of the book “Natural Gas Resource and its Applied Technology” | CMC Publishing CO.,LTD. (Tokyo, Japan 2008) |
| Development and Applications of Advanced Damping Materials | 17th Polymer Material Forum |
| Heat- and light-discoloring transparent epoxy resin cured by H-TMAn | 18th Polymer Material Forum |
| Transparent Polyimide using Alicyclic Monomer | The 2008 International Symposium for Flexible Electronics and Display(ISFED) |
| Features and applications of a new grade of nylon-MXD6 | Thin Wall Packaging 2008 |
| Film Insert Molding based on Polyoxymethylene and Poly(lactic acid): Effects of Molding Conditions and Crystallinity on the Interfacial Adhesion Properties | 16th Symposium of the Japan Society of Polymer Processing (JSPP) |
| Effect of Fibers Deformation on Scratch Behavior Induced by Dynamic Interaction Between Fiber Assemblies and Metallic Surface | 16th Symposium of the Japan Society of Polymer Processing (JSPP) |
| Oxygen and Moisure Free Packaging Solution -RP sytem / To protect reliability of soldering for Electoronic Devices. |
Japan Institute of Electronics Packaging, Study Grope of Electronic Parts |