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Research & Development

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Publications and Presentations in 2008

Title

Journals, Lectures,
or Society Meetings

Effects of light irradiation on bleaching by a 3.5% hydrogen peroxide solution containing titanium dioxide Laser Physics Letters
New Etchants for High Speed Anisotropic Etching of Silicon Journal of The Surface Finishing Society of Japan Vol.59 No.2
Evaluation of Adamantane derivatives for chemically amplified resist-a comparison between ArF,EUV and EB exposures- SPIE Advanced Lithography 2008
Thinly and Lightly Eye-Glass Lens Chemistry & Chmical Industry ・ The Chemical Society of Japan
Features and Application of MX Nylon New Grade "K7007C"  
Fabrication of thin film silicon solar cells using substrates with resin texture The 55th Spring Meeting of the Japan Society of Applied Physics and Related Societies
DNA introduction into living cell by water droplet impact with electrospray Angewandte chemie International Edition 2008-47/8
Film Insert Molding based on Polyoxymethylene and Poly(lactic acid): Effects of Molding Conditions and Crystallinity on the Interfacial Adhesion Properties 19th Annual Meeting of the Japan Society of Polymer Processing (JSPP)
Oil-adsorptive and bioremediation agent The 14th Symposium on Soil and Groundwater Contamination and Remediation
On-site Production of Peroxymonosulfuric Acid for Hexenuronic Acid Removal from Kraft Pulp 2008 International Pulp Breaching Conference
Development and Applications of innovative damping materials “ neofade ” KOBUNSHI (High Polymers, Japan) Vol.57 No.8 (2008)
Mitsubishi Gas Chamical's Methanol Process "Kagakukougaku"(Chemical Engineering of Japan, 72(8) P25, (2008)
characteristics of neutral Fenton method for purification VOC of contaminated groundwater Symposium on Soil and Groundwater Contamination and Remediation
Transparent PI film "NEOPULIM L" Japanese Society of Printing Science and Technology P&L society
Basic Study on Scratch Behavior Induced by Dynamic Interaction Between Fiber Assemblies and Metallic Surface 19th Annual Meeting of the Japan Society of Polymer Processing (JSPP)
Film Insert Molding based on Polyoxymethylene and Poly(lactic acid): Effects of Molding Conditions and Crystallinity on the Interfacial Adhesion Properties 19th Annual Meeting of the Japan Society of Polymer Processing (JSPP)
New product release (HL832NS, FL700, LE900) JPCA Show 2008
New transparent PI film Short Courses on Flexible Electronics
Preservation Method for Electronic Devices by Oxygen and Moisture Free Packaging, and Effectiveness of Prevent Delamination and Keeping Reliability of a Connection 18th Micro-Electronics Symposium
VOC purification characteristic examination that uses neutral Fenton method The Japanese Geotechnical Society
Mechanical Property and Crystal Structure of Polyoxymethylene and Poly(lactic acid)Polymer Blend Seventh Joint Canada-japan Workshop on Composites
Characteristics of neutral Fenton method for purification VOC of contaminated groundwater and applications of in-situ remediation Japan Society of Civil Engineers
YUTLAS ACE Soil and Groundwater Remediation Technology Expo 2008, Nikkan Kogyo Shimbun
Methanol (Part of the book "Natural Gas Resource and its Applied Technology" CMC Publishing CO.,LTD. (Tokyo, Japan 2008)
Development and Applications of Advanced Damping Materials 17th Polymer Material Forum
Heat- and light-discoloring transparent epoxy resin cured by H-TMAn 18th Polymer Material Forum
Transparent Polyimide using Alicyclic Monomer The 2008 International Symposium for Flexible Electronics and Display(ISFED)
Features and applications of a new grade of nylon-MXD6 Thin Wall Packaging 2008
Film Insert Molding based on Polyoxymethylene and Poly(lactic acid): Effects of Molding Conditions and Crystallinity on the Interfacial Adhesion Properties 16th Symposium of the Japan Society of Polymer Processing (JSPP)
Effect of Fibers Deformation on Scratch Behavior Induced by Dynamic Interaction Between Fiber Assemblies and Metallic Surface 16th Symposium of the Japan Society of Polymer Processing (JSPP)
Oxygen and Moisure Free Packaging Solution -RP sytem / To protect reliability of soldering
for Electoronic Devices.
Japan Institute of Electronics Packaging, Study Grope of Electronic Parts

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