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Research & Development

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Publications and Presentations in 2007

Title

Journals, Lectures,
or Society Meetings

Dynamic viscoelastic and damping properties of polymer composite for Oberst beams
Development and Applications of innovative damping materials "Neofade"
Journal of the Society of Rubber Industry, Japan, January
Wet etching of ZnO thin film 37th study meeting of 166th Committee on Photonic and Electronic Oxide Materials (Japan Society for the Promotion of Science)
Features and applications of PAI composite, AI polymer Engineering plastics news, January
Foundations and applications of chemical polishing, Applications for manufacturing of electronic parts 15th Technology seminar (Japan Photofabrication Association)
Bifunctional Low Molecular Weight Polyphenylene Ether Resins for PWB Base Materials IPC Printed Circuits Expo 2007
Reaction of H-TMAn with epoxy resin and properties of curing and products Seminar for Technical Information Institute
Case study of the inter-granular cracking of die casting parts made by Zinc alloy and the evaluation method of cracking sensitivity Symposium for Materials and Environment (Japan Society of Corrosion Engineering, Chugoku-Shikoku Branch)
Noise and vibration measures by high performance damping material "Neofade" Convertech, March (Converting Technical Institute)
Adhesive agent with gas barrier character Gas Separation, Permeation and Barrier Membranes (CMC Publishing)
Features and applications of oxygen absorbing film Ageless Omac Gas Separation, Permeation and Barrier Membranes (CMC Publishing)
Plastic lens containing sulfur The Frontiers of Sulfur Chemicals (CMC Publishing)
Reaction of Hydrogen Peroxide with Photo Activating Titanium dioxide Catalyst The 5th International Federation of Esthetic Dentistry World Congress
Case study of the inter-granular cracking of die casting parts made by Zinc alloy and the evaluation method of cracking sensitivity JSCE Materials and Environments 2007
Reaction of H-TMAn with epoxy resin and properties of curing and products 55th Annual Meeting
Features and Application of MX Nylon New Grade "K7007C" CONVERTECH(6)
“The characteristic of Low Dk Printed Wiring Board material, and optimization of a material design" , "The feature of heat-resistant BT Resin material, and deployment to a Copper Clad Laminate" "The collection of newest Electronics Packaging Encyclopedias <the first volume>"(Technical Information Institute)
Technology of the low dielectric constant resin, OPE Electronic materials/Plastic
Fluorination of β-Dicarbonyl Compounds by DFMBA  
Development status of DMFC in Mitsubishi Gas Chemical The Journal of Fuel Cell Technology Vol.8 No.1 Summer 2008
Heat resistant transparent film "NEOPULIM" CONVERTECH,35(10),69(2007)
Effect of PC-Oligomer on Structure and Properties of PC/ABS Injection Moldings SEIKEI KAKOU(Journal of the Japan Society of Polymer Processing)
Development of DMFC stacks and Power Generation Systems at Mitsubishi Gas Chemical Co., Inc. The Journal of Fuel Cell Technology Vol.7 No.1 Summer 2007 (FCDIC)
Wet-Oxidation of Silicon Surface with the Gas-Dissolved Water and UV Irradiation  
Development of Stepchemical Process The Japanese Society of Applied Physics, the 68th Autumn Meeting, 2007
Influence of Copper Electrocrystallization on the Etching The Japanese Society of Applied Physics, the 68th Autumn Meeting, 2007
Dynamic kinetic resolution of racemic 
α-aminonitriles to form chiral amino acids
Symposium of the 1 th Anniversaly of the Foundation of Yokohama Jisso Consortium
Production of In Vitro Fertilized Bovine Embryos Using Gas Concentration adjuster The 3rd Meeting of D-Amino Acid Research Society
The Development of the Thermosetting Resin Having the High Refractive Index The 100th annual meeting of the Japanese Society of Animal Reproduction
A damping material "Neofade", which can be adjusted to the target temperature and vibration frequency 'Polymer Colloquium' Sponsored by the Chemical Society of Japan touhoku branch office
Features and Application of MX Nylon New Grade "K7007C" 16th Polymer Material Forum Press Release
Gas Barrier Coating System "MAXIVE" The 45th All-Japan Packaging Technical Meeting
An acid anhydrides as hardener of epoxy resin, especially, reactions and advantages of H-TMAn A Lecture in TECHNICAL INFORMATION INSTITUTE CO.,LTD
Growth of High Quality (Zn,Mg)O Thick Films on ZnO Substrates by Liquid Phase Epitaxy. 2007 MRS Fall Meeting
OXYGEN AND MOISTURE FREE PACKAGING SOLUTION TO MAINTAIN DEVICES RELIABILITY FOR SOLDERING. The Second International Symposium on Smart Processing Technology
Heat- and light-discoloring transparent epoxy resin cured by H-TMAn 16th Polymer Material Forum

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