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Research & Development

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Publications and Presentations in 2006

Title

Journals, Lectures,
or Society Meetings

Epoxy curing reaction with nuclear hydrogenated Trimellitic anhydride and cured material The 55th Annual Meeting of the Society of Polymer Science, Japan
A corrosion case of carbon steel pipes for industrial water “Materials and Environment 2006,” the Spring Meeting of the Japan Society of Corrosion Engineering
Polyamide-imide/polyphenylene sulfide resin composite material The 14th Symposium on Composite Materials Interface
(poster session)
Development of new high performance damping material Advanced Chemistry and Industrial Technology Program
(special program of the 71st Annual Meeting of the Society of Chemical Engineers, Japan)
Epoxy resin cured with nuclear hydrogenated Trimellitic anhydride and its use Advanced Chemistry and Industrial Technology Program
(special program of the 71st Annual Meeting of the Society of Chemical Engineers, Japan)
Development and industrialization of new Trimethylolpropane production process Advanced Chemistry and Industrial Technology Program
(special program of the 71st Annual Meeting of the Society of Chemical Engineers, Japan)
Development of high-dielectric resin composite material Advanced Technology Program of the 86th Spring Annual Meeting of Chemical Society of Japan
Development of molecular resist material using various polyphenols Advanced Technology Program of the 86th Spring Annual Meeting of Chemical Society of Japan
Roughness evaluation of molecular resists Advanced Technology Program of the 86th Spring Annual Meeting of Chemical Society of Japan
Study on the wide-angle radio wave absorption of patterned radio wave absorber Advanced Technology Program of the 86th Spring Annual Meeting of Chemical Society of Japan
Field electron emission from oriented carbon nanotube bundles 2 Advanced Technology Program of the 86th Spring Annual Meeting of Chemical Society of Japan
Survey of line edge roughness and surface roughness of molecular resists The 53rd Applied Physics Related Association Lecture Meeting in Spring 2006
A corrosion case of facilities around chemical equipment and role of material technology in plants The 8th Plant Maintenance Workshop (hosted by Chugoku Forum on Chemical Engineering, Chugoku-Shikoku Branch of the Society of Chemical Engineers, Japan)
Low dielectric resin, OPE Convertech, March (Converting Technical Institute)
Development of field emission type cold cathode using oriented carbon nanotube bundles as electron source The 3rd Symposium on Vacuum Nanoelectronics, FED Project Public Symposium
Production of Hydrogen peroxide and related products Fine Chemical, March (CMC Publishing)
Production of Hydrogen peroxide and its use GIC 2005 Special Lecture Meeting
Dry laminate adhesive MAXIVE with gas barrier properties The 14th PPS Conference
Properties and application developments of AGELESS OMAC Syokuhin no Hoso, the journal of the Association of Food Packaging Technology
High refractive index thermosetting resin
(Lecture Collection of Polymer Frontier 21)
“Polymers that Manipulate Light, Light that Manipulates Polymers”
(Society of Polymer Science)
Heat Resistant Transparent Film "Neopulim®L", Innovative Damping Material "Neofade", H-TMA, H-TMAn 16th FPD R&D AND MANUFACTURING TECHNOLOGY EXPO & CONFERENCE
Thermosetting resin with high refractive index Seminar for recent technologies and market of polymers (The Society of polymer Science,Japan)
Bismaleimide/Triazine (BT resin) Engineering polymers (The Chemical Daily)
Microstructure and Catalytic Performance of SAPO-34 in Methylamine Synthesis. TOCAT5, 5th Tokyo Conference on Advanced Catalytic Science and Technology
Carbon nanotube as an electron emission source Seikei-Kakou, Journal of the Japan Society of Polymer Processing, vol.18, No.6
Development and Applications of innovative damping materials "Neofade" 2006 Autumn Meeting (Acoustical Society of Japan)
The Development of Negative Tone Resists Based on Non-polymeric Macromolecules with Polycyclic Aromatic Compounds 55th Symposium on Macromolecules (The Society of Polymer Science, Japan)
Reaction of H-TMAn with epoxy resin and properties of curing and products 1st Special Symposium in the 34th term (the Japan Society of Epoxy Resin Technology)
BT resin CCL Materials and Chemicals for Semiconductor Manufacturing Process (CMC Publishing)
White BT resin CCL for Chip LED Electronic materials, October (Kogyo Chosakai Publishing)
Oxygen absorbing film Ageless Omac Tokyo International Packaging Exhibition 2006 (Japan Packaging Institute), Food Packaging Seminar (Food Packaging Association of Japan)
A New Novel Oxidation method for Alicyclic compounds Convertech, October (Converting Technical Institute)
Characteristics and applications of MAXIVE as an adhesive agent for laminate Convertech, October (Converting Technical Institute)
Development of EUV Resists Based on Non-polymeric Macromolecules with Polyphenol Derivatives 5th International Extreme Ultraviolet Lithography Symposium
Development and Applications of innovative damping materials "Neofade" 15th Polymer materila forum (The Society of Polymer Science, Japan)
Heat-resistant and lightfastness transparent epoxy resin using H-TMAn (Poster Presentation) 15th Polymer materila forum (The Society of Polymer Science, Japan)
MGC's materials for the electronic circuit board 2007 ECB Technology Outlook, a separate volume of Electronic Journal
On the gas barrier adhesive agent, MAXIVE 44th All-Japan Packaging Technique Study Convention (Japan Packaging Institute)
Features and applications of oxygen absorbing film Ageless Omac 44th All-Japan Packaging Technique Study Convention (Japan Packaging Institute)
Technology of the low dielectric constant resin, OPE(Origo Phenylene Ether) JETI, December
Dynamic viscoelastic and damping properties of polymer composite for Oberst beams
Development and Applications of innovative damping materials "Neofade"
18th Elastomer symposium (The Society of Rubber Industry, Japan)
Development of Non-Polymeric Molecular Resist Materials for reducing LER 88th study meeting (the Japan Society of Applied Pysics, Silicon Technology Division)
Office bleaching agent, Pyrenees using photocatalyst TiO2 4th Photocatalyst Symposium (AIST)

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