Non-haloganated Low CTE BT Resin Laminate for IC Plastic Packages
Non-haloganated BT Materials
These are halogen free materials for PWB use. The halogen free materials achieve a flammability rating of UL94V-0 without using halogens, antimony, or phosphorus compound. The substitution of an inorganic filler as the flame retardant, has the additional benefits of improving the small hole CO2 laser drilling properties, and lowering the CTE.
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NX Type A |
GHPL-830NX Type A |
0.06, 0.1, 0.15, 0.2-0.8(0.1step), 0.25, 0.35, 0.45mm | 0.03, 0.035, 0.04, 0.045, 0.05, 0.06, 0.07, 0.1mm |
Features
CCL-HL832NX Type A / GHPL-830NX Type A is a halogen free BT material for IC plastic packages. Its properties are essentially the same as those of the thin IC package material CCL-HL832HS / GHPL-830HS.
Typical applications
Fully Green IC packages.
Non-haloganated Low CTE BT Materials
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NS |
GHPL-830NS |
0.03,0.04,0.05,0.06,0.1,0.15, 0.24,0.25,0.3,0.4(0.1step), 0.46mm |
0.025,0.03,0.035,0.04, 0.045,0.05,0.06,0.1mm |
Features
Low CTE and low shrinkage, effective to reduce the warpage of substrate for IC PKG
Superior heat resistance after moisture absorption because of low moisture absorption
30microns copper clad laminate and 25microns prepreg are available
Typical applications
Substrates for CSP,FC-PKG,BGA,PGA
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NS typeLC |
GHPL-830NS |
0.04,0.05,0.06,0.1,0.15, 0.2,0.25,0.3,0.4mm |
0.025,0.03,0.035, 0.04,0.045mm |
| CCL-HL832NS typeHD |
GHPL-830NS |
0.05,0.06mm | 0.035mm |
Features
Ultra Low CTE BT Material, Good Laser Drilling Processability
HL832NS type HD has higher stiffness with 2ply glass cloth construction
HL832NS type LC has much lower CTE and higher modulus
Typical applications
Substrates for CSP,FC-PKG,BGA,PGA
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NSR typeLC Series |
GHPL-830NSR Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4mm | 0.02, 0.025, 0.03, 0.035, 0.04, 0.045mm |
Features
Ultra Low CTE and low shrinkage, effective to reduce the warpage of IC PKG
High stiffness
Non-halogenated material
Typical applications
Substrates for CSP,FC-PKG,BGA,PGA
| Copper Clad Laminates | Prepregs | CCL Thickness | Prepreg Thickness |
|---|---|---|---|
| CCL-HL832NSF typeLC Series |
GHPL-830NSF Series |
0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4mm | 0.02, 0.025, 0.03, 0.035, 0.04, .045mm |
Features
Super Ultra Low CTE and low shrinkage, effective to reduce the warpage of IC PKG
High glass transition temperature
High stiffness
Non-halogenated material
Typical applications
Substrates for CSP,FC-PKG,BGA,PGA
| Item | Condition | Unit | HL832NX (A) |
HL832NS | HL832NS typeLC |
|
|---|---|---|---|---|---|---|
Dielectric Constant
| 1GHｚ |
－ |
4.9 |
4.4 |
4.0 |
|
5GHｚ |
－ |
4.8 |
4.3 |
3.9 |
||
10GHｚ |
－ |
4.7 |
4.3 |
3.9 |
||
| Dissipation Factor
| 1GHｚ |
－ |
0.011 |
0.006 |
0.006 |
|
5GHｚ |
－ |
0.011 |
0.008 |
0.007 |
||
10GHｚ |
－ |
0.012 |
0.008 |
0.008 |
||
| Insulation Resistance |
C-96/20/65 |
Ω |
1015-16 |
1015-16 |
1015-16 |
|
| Surface Resistance |
C-96/20/65 |
Ω |
1015-16 |
1015-16 |
1015-16 |
|
| Volume Resistivity |
C-96/20/65 |
Ω・cm |
1015-16 |
1016-17 |
1016-17 |
|
| Flexural Strength
|
MPa |
450 |
490 |
750 |
||
| Flexural Modulus
|
GPa |
28 |
27 |
30 |
||
| Tensile Strength
|
MPa |
270 |
290 |
400 |
||
| Young's Modulus
|
GPa |
28 |
27 |
30 |
||
| Glass Transition Temp.
|
DMA |
℃ |
230 |
255 |
255 |
|
TMA |
℃ |
200 |
230 |
230 |
||
| Cofficent of Thermal Expansion
|
X,Y |
α1 |
ppm/℃ |
14 |
10 |
7 |
X,Y |
α2 |
ppm/℃ |
5 |
3 |
3 |
|
| Peel Strength
|
12μm |
KN/m |
0.85 |
1.0 |
1.0 |
|
| Flame Resistance |
E-168/70 |
－ |
V-0 |
V-0 |
V-0 |
|
| Density |
g/cm3 |
2.1 |
1.9 |
1.9 |
||
| Heat capacity |
J/kg・K |
1.00 |
1.00 |
0.95 |
||
| Poissin's ratio |
－ |
0.19 |
0.18 |
0.18 |
||
| Moisture absorption |
85 ℃/85RH% 168h |
% |
0.44 |
0.31 |
0.30 |
|
| Item | Condition | Unit | HL832NS typeHD |
HL832NSR type LCA |
HL832NSF typeLCA |
|
|---|---|---|---|---|---|---|
Dielectric Constant
| 1GHｚ |
－ |
4.3 |
4.1 |
4.0 |
|
5GHｚ |
－ |
4.2 |
4.0 |
4.0 |
||
10GHｚ |
－ |
4.2 |
4.0 |
3.9 |
||
| Dissipation Factor
| 1GHｚ |
－ |
0.006 |
0.008 |
0.006 |
|
5GHｚ |
－ |
0.008 |
0.011 |
0.008 |
||
10GHｚ |
－ |
0.008 |
0.012 |
0.008 |
||
| Insulation Resistance |
C-96/20/65 |
Ω |
1015-16 |
1015-16 |
1015-16 |
|
| Surface Resistance |
C-96/20/65 |
Ω |
1015-16 |
1015-16 |
1015-16 |
|
| Volume Resistivity |
C-96/20/65 |
Ω・cm |
1016-17 |
1016-17 |
1016-17 |
|
| Flexural Strength
|
MPa |
480 |
670 |
600 |
||
| Flexural Modulus
|
GPa |
26 |
33 |
34 |
||
| Tensile Strength
|
MPa |
310 |
420 |
390 |
||
| Young's Modulus
|
GPa |
26 |
33 |
34 |
||
| Glass Transition Temp.
|
DMA |
℃ |
255 |
230 |
300 |
|
TMA |
℃ |
230 |
210 |
270 |
||
| Cofficent of Thermal Expansion
|
X,Y |
α1 |
ppm/℃ |
10 |
4.5 |
3 |
X,Y |
α2 |
ppm/℃ |
3 |
2 |
2 |
|
| Peel Strength
|
12μm |
KN/m |
1.0 |
1.0 |
0.9 |
|
| Flame Resistance |
E-168/70 |
－ |
V-0 |
V-0 |
V-0 |
|
| Density |
g/cm3 |
1.9 |
2.0 |
2.0 |
||
| Heat capacity |
J/kg・K |
0.95 |
0.95 |
0.9 |
||
| Poissin's ratio |
－ |
0.18 |
0.18 |
0.18 |
||
| Moisture absorption |
85 ℃/85RH% 168h |
% |
0.31 |
0.32 |
0.35 |
|
- *MGC also has halogen free materials, CCL-HL820, CCL-HL820W, and CCL-HL820WDB.
