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Non-haloganated Low CTE BT Resin Laminate for IC Plastic Packages

Non-haloganated BT Materials

These are halogen free materials for PWB use. The halogen free materials achieve a flammability rating of UL94V-0 without using halogens, antimony, or phosphorus compound. The substitution of an inorganic filler as the flame retardant, has the additional benefits of improving the small hole CO2 laser drilling properties, and lowering the CTE.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-HL832NX
Type A

GHPL-830NX
Type A

0.06, 0.1, 0.15,
0.2-0.8(0.1step), 0.25, 0.35, 0.45mm

0.03, 0.035, 0.04, 0.045, 0.05, 0.06, 0.07, 0.1mm

Features

CCL-HL832NX Type A / GHPL-830NX Type A is a halogen free BT material for IC plastic packages. Its properties are essentially the same as those of the thin IC package material CCL-HL832HS / GHPL-830HS.

Typical applications

Fully Green IC packages.

Non-haloganated Low CTE BT Materials

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-HL832NS

GHPL-830NS

0.03,0.04,0.05,0.06,0.1,0.15,
0.24,0.25,0.3,0.4(0.1step),
0.46mm

0.025,0.03,0.035,0.04,
0.045,0.05,0.06,0.1mm

Features

Low CTE and low shrinkage, effective to reduce the warpage of substrate for IC PKG Superior heat resistance after moisture absorption because of low moisture absorption 30microns copper clad laminate and 25microns prepreg are available

Typical applications

Substrates for CSP,FC-PKG,BGA,PGA

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-HL832NS typeLC

GHPL-830NS

0.04,0.05,0.06,0.1,0.15,
0.2,0.25,0.3,0.4mm

0.025,0.03,0.035,
0.04,0.045mm

CCL-HL832NS typeHD

GHPL-830NS

0.05,0.06mm

0.035mm

Features

Ultra Low CTE BT Material, Good Laser Drilling Processability
HL832NS type HD has higher stiffness with 2ply glass cloth construction
HL832NS type LC has much lower CTE and higher modulus

Typical applications

Substrates for CSP,FC-PKG,BGA,PGA

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-HL832NSR
typeLC Series

GHPL-830NSR Series

0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4mm

0.02, 0.025, 0.03, 0.035, 0.04, 0.045mm

Features

Ultra Low CTE and low shrinkage, effective to reduce the warpage of IC PKG
High stiffness
Non-halogenated material

Typical applications

Substrates for CSP,FC-PKG,BGA,PGA

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-HL832NSF
typeLC Series

GHPL-830NSF Series

0.03, 0.04, 0.05, 0.06, 0.1, 0.15, 0.2, 0.25, 0.3, 0.4mm

0.02, 0.025, 0.03, 0.035, 0.04, .045mm

Features

Super Ultra Low CTE and low shrinkage, effective to reduce the warpage of IC PKG
High glass transition temperature
High stiffness
Non-halogenated material

Typical applications

Substrates for CSP,FC-PKG,BGA,PGA

Typical properties of Materials
Item Condition Unit HL832NX
(A)
HL832NS HL832NS
type LC

Dielectric Constant

  1GHz 4.9 4.4 4.0
  5GHz 4.8 4.3 3.9
  10GHz 4.7 4.3 3.9

Dissipation Factor

  1GHz 0.011 0.006 0.006
  5GHz 0.011 0.008 0.007
  10GHz 0.012 0.008 0.008

Insulation Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16

Surface Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16

Volume Resistivity

  C-96/20/65 Ω・cm 1015-16 1016-17 1016-17

Flexural Strength

    MPa 450 490 750

Flexural Modulus

    GPa 28 27 30

Tensile Strength

    MPa 270 290 400

Young's Modulus

    GPa 28 27 30

Glass Transition Temp.

DMA   230 255 255

TMA

  200 230 230

Cofficent of Thermal Expansion

X,Y α1 ppm/℃ 14 10 7
X,Y α2 ppm/℃ 5 3 3

Peel Strength

  12μm KN/m 0.85 1.0 1.0

Flame Resistance

  E-168/70 V-0 V-0 V-0

Density

    g/cm3 2.1 1.9 1.9

Heat capacity

    J/kg・K 1.00 1.00 0.95

Poissin's ratio

    0.19 0.18 0.18

Moisture absorption

  85 ℃/85RH% 168h % 0.44 0.31 0.30
Typical properties of Materials
Item Condition Unit HL832NS
type HD
HL832NSR type LCA HL832NSF typeLCA

Dielectric Constant

  1GHz 4.3 4.1 4.0
  5GHz 4.2 4.0 4.0
  10GHz 4.2 4.0 3.9

Dissipation Factor

  1GHz 0.006 0.008 0.006
  5GHz 0.008 0.011 0.008
  10GHz 0.008 0.012 0.008

Insulation Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16

Surface Resistance

  C-96/20/65 Ω 1015-16 1015-16 1015-16

Volume Resistivity

  C-96/20/65 Ω・cm 1016-17 1016-17 1016-17

Flexural Strength

    MPa 480 670 600

Flexural Modulus

    GPa 26 33 34

Tensile Strength

    MPa 310 420 390

Young's Modulus

    GPa 26 33 34

Glass Transition Temp.

DMA   255 230 300
TMA   230 210 270

Cofficent of Thermal Expansion

X,Y α1 ppm/℃ 10 4.5 3
X,Y α2 ppm/℃ 3 2 2

Peel Strength

  12μm KN/m 1.0 1.0 0.9

Flame Resistance

  E-168/70 V-0 V-0 V-0

Density

    g/cm3 1.9 2.0 2.0

Heat capacity

    J/kg・K 0.95 0.95 0.9

Poissin's ratio

    0.18 0.18 0.18

Moisture absorption

  85 ℃/85RH% 168h % 0.31 0.32 0.35

MGC also has halogen free materials, CCL-HL820, CCL-HL820W, and CCL-HL820WDB.

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