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High Performance FR-4 for Multi-layered PWB

High Performance FR-4 for Multi-layered PWB


Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-EL190T
GEPL-190T
0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50, 1.00, 1.20, 1.60mm 0.03, 0.04, 0.05, 0.06, 0.08, 0.10, 0.15, 0.20mm

Features

CCL-EL190T / GEPL-190T has a higher Tg, lower CTE properties compared to CCL-EL 190 / GEPL-190. It is available for lead free reflow process, and especially excels in through hole connection reliability for high count multilayer motherboards. And, microvias can be easily made in the prepreg layers by CO2 laser drilling.

Typical applications

High count multilayer motherboards for internet routers, servers and IC tester devices.


　
Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-EL190T
type M
GEPL-190T
type M
 0.06,0.08,0.09,0.10,0.13,0.15,0.20
0.25,0.30,0.40,0.50mm		 0.03,0.04,0.06,0.08,0.10,
0.15mm

Features

Suitable for High Count Multilayer PWB due to Low Expansion,Low Loss. High Tg, Excellent Suitable for Lead Free Reflow

Typical applications

High count multilayer motherboards for internet routers, servers and IC tester devices.


　
Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-EL230T
GEPL-230T
0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50mm 0.04, 0.06, 0.10, 0.15mm

Features

CCL-EL230T / GEPL-230T excels in through hole connection reliability because of its high Tg and low CTE properties. And also, it is very suitable for high frequency circuits because of its low dielectric properties. It excels in filling to BVH and IVH because of good resin flow properties. In addition, microvias can be easily made in the prepreg layers by CO2 laser drilling, and it is available for lead free reflow process.

Typical applications

High count multilayer motherboards for internet routers, servers, base stations, switching systems and IC tester devices.


　
Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness
CCL-FL700
GFPL-700
 0.06, 0.10, 0.13, 0.15, 0.2, 0.25, 0.3, 0.4, 0.5 0.03, 0.04, 0.06, 0.08, 0.10

Features

Low Dk, Low Df and Low Transmission Loss Compared to FR-4 materials. Suitable for High Count Multilayer PWB due to Low Expansion,Low Loss. High Tg, Excellent Suitable for Lead Free Reflow

Typical applications

High count multilayer motherboards for internet routers, servers and IC tester devices.


　
Typical properties of Materials
Item Condition Unit EL190T EL190T
type M		 EL230T FL700
Dielectric Constant
1MHz
A
—
4.7
4.1
4.0
4.0
1GHz
A
—
4.3
3.9
3.8
3.8
10GHz
A
—
4.1
3.7
3.6
3.6
Dissipation Factor
1MHz
A
—
0.010
0.007
0.004
0.002
1GHz
A
—
0.011
0.008
0.005
0.003
10GHz
A
—
0.012
0.009
0.007
0.005
Insulation Resistance
 
C-96/20/65
Ω
5x1013-15
5×1013-15
5x1013-15
5x1013-15
Surface Resistance
 
C-96/20/65
Ω
5x1014-16
5×1014-16
5x1014-16
5x1014-16
Volume Resistivity
 
C-96/20/65
Ω·cm
5x1012-14
5×1012-14
5x1012-14
5x1012-14
Flexural Strength
Warp
A
MPa
580
480
470
460
Fill
A
MPa
530
470
460
450
Flexural Modulus
Warp
A
GPa
27
23
22
23
Fill
A
GPa
27
23
22
23
Tensile Strength
Warp
A
MPa
330
310
300
300
Fill
A
MPa
330
260
250
250
Young's Modulus
Warp
A
GPa
27
23
22
23
Fill
A
GPa
26
23
22
23
Poisson's Ratio
Warp
A
—
0.17
0.16
0.16
0.18
Fill
A
—
0.16
0.15
0.15
0.18
Glass Transition Temp.
DMA
A
℃
240
240
210
230
TMA
A
℃
220
220
175
205
DSC
A
℃
215
215
175
200
Cofficent of Thermal Expansion
Warp, Fill
A
ppm/℃
14
15
15
15
Z
(α1, α2)
A
ppm/℃
40/180
45/200
45/240
45/240
Thermal Conductivity
Laser Pulse Heating Method
A
W/m·K
0.45
0.44
0.44
0.39
Specific Heat
DSC
A
J/Kg·K
950
950
950
950
Decomposition Temp.
TG-DTA
A
℃
345
345
335
350
Time to Delamination
T-260
E-2/105
minutes
＞60
>60
＞60
＞60
T-288
E-2/105
minutes
20
20
12
20
T-300
E-2/105
minutes
7
7
3
7
Peel Strength
12μ
A
KN/m
0.9
0.9
0.9
0.7
18μ
A
KN/m
1.2
1.2
1.2
-
18μ-VLP
A
KN/m
1.1
1.1
1.1
0.8
Specific Gravity of Resin
 
A
—
1.44
1.44
1.42
1.51
Flame Resistance
UL94
E-168/70
—
V-0
V0
V-0
V-0