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High Performance FR-4 for Multi-layered PWB

High Performance FR-4 for Multi-layered PWB

Copper Clad Laminates Prepregs CCL
Thickness
Prepreg
Thickness

CCL-EL190T

GEPL-190T

0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50, 1.00, 1.20, 1.60mm

0.03, 0.04, 0.05, 0.06, 0.08, 0.10, 0.15, 0.20mm

Features

CCL-EL190T / GEPL-190T has a higher Tg, lower CTE properties compared to CCL-EL 190 / GEPL-190. It is available for lead free reflow process, and especially excels in through hole connection reliability for high count multilayer motherboards. And, microvias can be easily made in the prepreg layers by CO2 laser drilling.

Copper Clad Laminates Prepregs CCL Thickness Prepreg Thickness

CCL-EL230T

GEPL-230T

0.06, 0.10, 0.13, 0.15, 0.20, 0.25, 0.30, 0.40, 0.50mm

0.04, 0.06, 0.10, 0.15mm

Features

CCL-EL230T / GEPL-230T excels in through hole connection reliability because of its high Tg and low CTE properties. And also, it is very suitable for high frequency circuits because of its low dielectric properties. It excels in filling to BVH and IVH because of good resin flow properties. In addition, microvias can be easily made in the prepreg layers by CO2 laser drilling, and it is available for lead free reflow process.

Typical applications

High count multilayer motherboards for internet routers, servers, base stations, switching systems and IC tester devices.

Typical properties of Materials
Item Condition Unit EL190T EL230T

Dielectric Constant

1MHz

A 4.7 4.0

1GHz

A 4.3 3.8

10GHz

A 4.1 3.6

Dissipation Factor

1MHz

A 0.010 0.004

1GHz

A 0.011 0.005

10GHz

A 0.012 0.007

Insulation Resistance

  C-96/20/65 Ω 5x1013-15 5x1013-15

Surface Resistance

  C-96/20/65 Ω 5x1014-16 5x1014-16

Volume Resistivity

  C-96/20/65 Ω・cm 5x1012-14 5x1012-14

Flexural Strength

Warp

A MPa 580 470

Fill

A MPa 530 460

Flexural Modulus

Warp

A GPa 27 22

Fill

A GPa 27 22

Tensile Strength

Warp

A MPa 330 300

Fill

A MPa 330 250

Young's Modulus

Warp

A GPa 27 22

Fill

A GPa 26 22

Poisson's
Ratio

Warp

A 0.17

0.16

Fill

A 0.16 0.15

Glass Transition Temp.

DMA

A 240 210

TMA

A 220 175

DSC

A 215 175

Cofficent of Thermal Expansion

Warp, Fill

A ppm/℃ 14 15

Z
(α1、α2)

A ppm/℃ 40/180 45/240

Thermal Conductivity

Laser Pulse Heating Method

A W/m・K 0.45 0.44

Specific Heat

DSC

A J/Kg・K 950 950

Decomposition Temp.

TG-DTA

A 345 335

Time to
Delamination

T-260

E-2/105 minutes >60 >60

T-288

E-2/105 minutes 20 12

T-300

E-2/105 minutes 7 3

Peel Strength

12μ

A KN/m 0.9 0.9

18μ

A KN/m 1.2 1.2

18μ-VLP

A KN/m 1.1 1.1

Specific Gravity of Resin

  A 1.44 1.42

Flame Resistance

UL94

E-168/70 V-0 V-0

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